Adhesion to Metal - Potting Compound

Adhesion testing of potting/molding compound to metal is designed to assess the bonding strength between the compound used for insulation and sealing and a metal substrate in the electrical assembly. Effective adhesion of the potting compound is essential to the assembly’s durability and protection from external factors.

A primed metal panel will be coated in a layer of the potting compound under test and allowed to cure. A tensile testing machine is then used to apply a specified shear force to the specimen until cohesive failure. A force-displacement curve will be generated and evaluated.