Adhesion testing of potting/molding compound to neoprene (rubber) is designed to assess the bonding strength between the compound used for insulation and sealing and the rubber components in the electrical assembly. Effective adhesion of the potting compound is essential to the assembly’s durability and protection from external factors.
Abraded rubber sheets will be formed to create a cavity to be filled with the molding compound under test. A tensile testing machine is then used to apply a specified shear force to the specimen until cohesive failure. A force-displacement curve will be generated and evaluated.