Soldering is a common method for wire termination and the adhesion of the solderability is critical for both mechanical and electrical performance. Certain conductor platings, such as tin and silver, are more solderable and thus used for these applications.
The solderability of a wire conductor examines how well a solder adheres to a conductor. Any wire/cable conductor can be tested for solderability (cable shielding may also be tested with this technique).
Parameters that may be changed for this test include:
Solder application method
Post-solder assessment technique
See this article for more information on solderability.
Perform visual examination of the specimen. Record any observed defects.
Remove the conductor from the specimen. Care should be taken to prevent abrasion and/or contamination of the specimen conductor.
Dip the specimen conductor end into ambient temperature flux.
Dip the specimen conductor end into molten solder at a uniform temperature.
Perform visual examination of the specimen under magnification to determine solder coverage.
Report the flux and solder used, the test conditions, solder coverage, and any specimen preconditioning (if applicable).