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Conductor Solderability

Chemical FOR: Conductor $2,290

Soldering is a common method for wire termination and the adhesion of the solderability is critical for both mechanical and electrical performance. Certain conductor platings, such as tin and silver, are more solderable and thus used for these applications.

The solderability of a wire conductor examines how well a solder adheres to a conductor. Any wire/cable conductor can be tested for solderability (cable shielding may also be tested with this technique).

Parameters that may be changed for this test include:

See this article for more information on solderability.

Procedure

  1. Perform visual examination of the specimen. Record any observed defects.
  2. Remove the conductor from the specimen. Care should be taken to prevent abrasion and/or contamination of the specimen conductor.
  3. Dip the specimen conductor end into ambient temperature flux.
  4. Dip the specimen conductor end into molten solder at a uniform temperature.
  5. Perform visual examination of the specimen under magnification to determine solder coverage.
  6. Report the flux and solder used, the test conditions, solder coverage, and any specimen preconditioning (if applicable).

Covered specifications

  • ANSI/ NEMA WC27500 Method 4.3.18
  • AS22759 Method 5.2.3
  • AS4373 Method 105
  • AS6324 Method 5.2.3
  • AS81044 Method 4.7.5.26
  • EN3475 Method 509
  • J1127 Method 6.2
  • J1128 Method 6.2
  • MIL-DTL-32630 Method 4.7.18
  • MIL-PRF-55514 Method 4.8.16
  • MIL-STD-202 Method 208
  • MIL-STD-2223 Method 5004
  • 8201000-8201010 Method 3.2
  • J1127 Method 6.02
  • J1128 Method 6.02
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