Temperature Cycling
Connectors are cycled between a low temperature and high temperature environment, and the plating is examined. This is an examination to ensure that after temperature changes connectors do not display signs of peeling, blistering, flaking, and separation of plating or other damage detrimental to the operation of the connector.
Covered specifications
- AS23190 D Method 4.7.4.2
- AS5382 Method 5.6.5
- EIA-364 Method 32
- MIL-DTL-38999 Method 4.5.4
- MIL-DTL-83513 Method 4.5.10
- MIL-DTL-83733 Method 4.7.4
- AS6370 Method 4.6.7
- ISO 19642-2 Method 6.5.9
- J1127 Method 6.11
- J1128 Method 6.17
- JES292 Method 18
- MIL-PRF-85045G Method 4.7.6.1