Method 215 is the Resistance to Solvents test with two purposes: (a) to verify that markings or color coding will not become illegible or discolored on parts when subjected to solvents normally used to clean solder flux, fingerprints, and other contaminants from printed-wiring and terminal-board assemblies; and (b) to verify that component protective coating, encapsulation material and sleeve material resistance are not degraded to the point where electrical or mechanical integrity is disturbed.
The test uses specified solvent formulations considered typical of those used in electronics manufacturing. Parts are immersed and/or brushed with the solvents and then examined for legibility and physical damage.
This test is essential for ensuring that military electronic components maintain their identification markings and structural integrity through the manufacturing and maintenance cleaning processes.
Method 4.7.23 tests resistance to solvents for military relays. Relays are tested in accordance with method 215 of MIL-STD-202 with the following exceptions: the portion to be brushed includes all markings.
One sample shall be tested with each solvent solution. For qualification inspection, samples in excess of the available number of solvents are exempt from testing. For group C testing, two additional samples are selected.
This test verifies that relay markings and external finishes will remain intact and legible when exposed to the various cleaning solvents used in military electronics manufacturing and maintenance operations.
Method 4.8.2 tests resistance to solvents for mica dielectric capacitors. Capacitors are tested in accordance with MIL-STD-202-215 (resistance to solvents test method). Brushing is not required for this application.
The test evaluates whether capacitor markings and protective coatings maintain their integrity when exposed to the solvents and cleaning processes commonly used in military electronics manufacturing and maintenance.
This is important because capacitors in military equipment may be subjected to various cleaning agents during PCB assembly and field maintenance operations.