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Bonding compounds are often used as a means of protecting electrical terminations from the moisture and other contaminates. Furthermore, proper adhesion of potting compounds can have a positive impact on component durability to vibration and mechanical shocks. The bondability of insulation to potting compounds test evaluates the adhesion to the wire/cable insulation.
In this test, the potting compound is cured on the wire/cable specimen. Once cured, the bondability of the insulation to potting compounds is evaluated by a mechanical pull test.
Parameters that can be changed for this test include:
- Potting compounds
- Sample preparation method
- Curing time
- Curing temperature
Visual examine the specimen and record any defects.
Mount the specimen into the mold.
Inject the potting compound into the mold and place into an oven to cure.
Remove the specimen from the mold.
Perform a pull test on each of the five specimens.
Report the maximum pull force, and the potting compound separation/failure mode.